COMPONENTS:
Terminations, Attenuators, Loads, DC Blocks, Chip Resistors, Custom Cable Assemblies, Launchers, Adapters, Chip Attenuators,
FEEDTHRUS:
Adaptors, Test Fixtures, Custom Cable Assemblies, Launchers, Capacitors,
CONNECTORS:
Hermetic, Non-Hermetic, Precision 7mm and Custom Hermetic Seals, GTMS/RFIs, Adaptors,
CIRCUIT FRAMES:
RF/MW Packaging, Hermetic and Non-Hermetic,
SUBSTRATES:
Metalized and Unmetalized Microwave Thin Film Circuits,
MICROWAVE CIRCUITS:
Etching, Machining, Drilling, Plated Bonding Assembly, Plated Thru Holes, PTFE on Aluminum, Teflon, etc.
THERMAL MANAGEMENT:
Aluminum Nitride (AIN), BeO, BN, SIC, Direct Bond Copper. Lapped, Scribed, Polished, and Drilled, Any Configuration,
SPECIALTY METALS and ALLOY COMPOUNDS:
Thin/Thick Film, Super Conductor Application, Sputtering Targets, Evaporated Charges, Assaying and Reclamation,
CUSTOM DESIGN/FABRICATION:
Machining and plating of circuit frames and other hardware; Fast turn around; Assorted materials;
PRECISION PLATING:
To Mil Spec, NASA, and Q.A.; All plating finishes available; Selective plating;